Contact Information
Company Information
Company
高云半导体 Gowin Semiconductor Corp
Total Funding
132000000.0
Technologies
Microsoft Office 365
Amazon AWS
Google Tag Manager
Mobile Friendly
Zopim
Google Analytics
Apache
Android
IoT
AI
Remote
Keywords
innovation
fpga
semiconductors
srambased fpga devices
flashbased nonvolatile fpga devices
semiconductor manufacturing
programmable logic devices
gowin eda
low power
high performance
arora v fpgas
littlebee fpgas
ai operations
automotive
consumer electronics
industrial automation
communications
medical devices
data centers
embedded systems
development kits
design tools
ip cores
transceivers
mipi dsi
mipi csi-2
pcie interface
high-speed interfaces
dsp blocks
ddr3 memory
flash-based fpgas
low-density fpgas
field oriented control
video bridging
ai & edge computing
security functions
integrated arm cortex-m
uart
i2c
lvds
ethernet
high-throughput
total cost of ownership
time to market
data aggregation
usb 2.0
bluetooth low energy
hardcore mipi
systemverilog
verilog
bitstream generation
multi-boot support
programmable logic
power management
edge computing solutions
hardware
consumers
mechanical or industrial engineering
hospital & health care
internet service providers
information technology & services
embedded hardware & software
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