Hans Hasselby-Andersen

Outlook Amazon AWS reCAPTCHA Typekit Mobile Friendly Remote

semiconductors power converters electronics power modules dc dc converters semiconductor power supply ic design nanofabrication ieee microinductors passive interposer power supply in package semiconductor manufacturing thermal performance power density silicon interposers high efficiency heterogeneous integration power interposer technology advanced packaging voltage regulator modules ai computing data center power management power-system-in-package telecom solutions networking applications consumer electronics thermal management miniaturized power supplies synchronous buck converters step-up power modules thermal guide electrically isolated components high-performance processors integration technology energy consumption compact devices 5g technology 6g applications power conversion high-power ai chips fpgas optical transceivers mmwave platforms semiconductor industry latest semiconductor technology research & development grants & funding international partnerships copenhagen technology digital electronics industry leaders investment rounds power electronics integrated circuit design deep-tech venture firm easy integration demand for innovative packaging unmatched thermal performance high voltages hardware computer hardware consumers