Contact Information
Company Information
Company
FlipChip International
Annual Revenue
54000000.0
Technologies
Outlook
Amazon AWS
Google Maps (Non Paid Users)
Google Maps
Bootstrap Framework
Mobile Friendly
Apache
Google Font API
Remote
Keywords
semiconductor wafer solder bumping
multi project wafers
semiconductor assembly & test
backgrind
wafer saw
tape & reel
laser mark
semiconductor manufacturing
wafer bumping
flip chip
wlcsp
cu pillar bumping
wafer probe test
die services
wafer dicing
wafer inspection
wafer placement
thin film redistribution
underbump metallurgy
solder alloy options
full turnkey solution
automated optical inspection
design services
pwb design
high volume manufacturing
r&d laboratory
application development
quality control
iso 9001
iso 14001
medical electronics
automotive electronics
consumer electronics
industrial electronics
military electronics
mems devices
high reliability packaging
minimization solutions
advanced packaging technology
sputtered film
nanopillar bumps
electroplated cu rdl
high current applications
die sales division
tape & reel services
multi-chip module testing
production ramp-up capabilities
environmental compliance
safety protocols
continuous improvement
customer satisfaction
turnkey manufacturing
packaging solutions
high volume processing
market leadership
technology partnerships
clean room fabrication
semiconductors
hardware
app development
apps
software development
information technology & services
consumers
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