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semiconductor equipment semiconductor manufacturing plasma solutions wafer manufacturing photoresist removal surface cleaning isotropic etching uv curing charge erase neo series high volume manufacturing cost of ownership low maintenance reduced footprint multiple wafer sizes substrate materials advanced processing capabilities environmental-friendly processes ash processing descum cleaning surface preparation photoresist bulk ashing high dose implant stripping polymere removal non-critical isotropic etching sacrificial layer release surface treatments wafer level packaging cmos power rf mems led photoresist uv curing plasma technology dual chamber configuration rf technology microwave technology highly reliable systems reduced maintenance state of the art components global support iso-9001 accredited plasma-based systems semiconductor industry plasma-based solutions neo equipment series ashing isotropic etch photoresist curing wafer sizes automotive industry cloud computing 5g technology advanced packaging power semiconductors analog sustainability eco-friendly practices customer support high precision reliability efficiency strategic partnerships global presence foundries integrated device manufacturers low cost of ownership high performance innovative technology customer-centric approach semiconductors hardware enterprise software enterprises computer software information technology & services b2b environmental services renewables & environment