Vijay Israni

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ate testing semiconductor backend services reliability testing packaging qualification testing failure analysis logistics management semiconductor manufacturing turnkey services engineering services production test services device qualification hardware development test engineering test program development wafer probe wafer bump substrate design wafer level packaging flip chip system-in-package environmental testing mechanical testing quality assurance production support customized test solutions test hardware development production reliability burn-in services esd testing mems testing backend services 24/7 production services dynamic engineering support test capabilities device qualification services engineering test silicon verification package assembly package design package characterization real time wip access short cycle time finished good management test platforms cost-effective solutions largest installed base production yield improvement high volume production device characterization advanced test solutions raw semiconductor testing test interface development customer partnership technical support semiconductors hardware information technology & services packaging design